Product image - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010

The DIN EN 60191-6 standard series is based on the corresponding IEC 60191-6 series of International standards. It defines rules for outline drawings of surface mounted semiconductor device packages... Read overview

Publication date: 2010-08

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Language: German
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