Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)
German title
Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-2: Prüfverfahren für bestückte Leiterplatten: Teil Lötflussmittel (IEC 91/1070/CD:2012)
Date of issue
2013-04-02
Publication date
2013-04
Original language
German,
English
Pages
83
Date of issue
2013-04-02
Publication date
2013-04
Original language
German,
English
Pages
83
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