Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994

Publication date: 1994-09

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009); German version EN 61188-7:2009

Publication date: 2009-12

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002

Publication date: 2003-01

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007

Publication date: 2007-11

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)

Publication date: 2012-03

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for flux-cored and solid solders in the form of rods, bars, sticks, ribbon, solder powder and... Read overview

Publication date: 2011-04

Workmanship requirements for soldered electronic assemblies - Part 1: General (IEC 61192-1:2003); German version EN 61192-1:2003

Publication date: 2003-11

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003

Publication date: 2003-11

Workmanship requirements for soldered electric assemblies - Part 3: Through-hole mount assemblies (IEC 61192-3:2002); German version EN 61192-3:2003

Publication date: 2003-10

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003

Publication date: 2003-11