Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices (IEC 47/2325/CD:2016)
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 41: Zuverlässigkeitsprüfverfahren für nichtflüchtige Speicher-Bauelemente (IEC 47/2325/CD:2016)
Date of issue
2017-03-24
Publication date
2017-04
Original language
German,
English
Pages
35
Date of issue
2017-03-24
Publication date
2017-04
Original language
German,
English
Pages
35
DOI
https://dx.doi.org/10.31030/2641439
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