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Draft standard [WITHDRAWN]

DIN EN 61190-1-3:2015-05 - Draft

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)

German title
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten (IEC 91/1231/CD:2014)
Date of issue
2015-04-03
Publication date
2015-05
Original language
German, English
Pages
72

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Date of issue
2015-04-03
Publication date
2015-05
Original language
German, English
Pages
72

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Replacement amendments

This document has been replaced by: DIN EN IEC 61190-1-3:2018-09 .

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