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Draft standard [WITHDRAWN]

DIN EN 61191-3:2016-01 - Draft

Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)

German title
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage (IEC 91/1300/CD:2015)
Date of issue
2015-12-18
Publication date
2016-01
Original language
German, English
Pages
32

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Date of issue
2015-12-18
Publication date
2016-01
Original language
German, English
Pages
32

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Replacement amendments

This document has been replaced by: DIN EN 61191-3:2018-05 .

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