VDI/VDE 3719 Blatt 1:2019-05 - Draft

Manufacturing of mechatronic integrated devices (MID) - Laser direct structuring

German title: Herstellung von mechatronisch integrierten Baugruppen (Mechatronic Integrated Devices, MID) - Laserdirektstrukturierung
Publication date: 2019-05
Original language: German
Pages: 22

Publication date: 2019-05
Original language: German
Pages: 22

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Short description

MID technology enables the integration of mechanical, electrical, electronic and thermal functions on a spatial circuit carrier. This enables assemblies with a high functional density and a considerable degree of miniaturization. At present, however, there are no generally applicable standards for the manufacture of MIDs that process managers and customers can use as a guideline. This standard provides detailed information on laser direct structuring. It is aimed at users and producers of mechatronically integrated assemblies.

Content

ICS

31.220.01, 39.020

Replacement amendments

This document has been replaced by: VDI/VDE 3719 Blatt 1:2021-03 .

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