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Draft standard [WITHDRAWN]

DIN 50002-1:2019-07 - Draft

Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test

German title
Klebungen in elektronischen Anwendungen - Haftfestigkeit an Oberflächen - Teil 1: Zugprüfung
Date of issue
2019-05-31
Publication date
2019-07
Original language
German
Pages
16

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Date of issue
2019-05-31
Publication date
2019-07
Original language
German
Pages
16
DOI
https://dx.doi.org/10.31030/3059528

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Content
ICS
31.020, 83.180
DOI
https://dx.doi.org/10.31030/3059528
Replacement amendments

This document has been replaced by: DIN 50002-1:2020-03 .

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