DIN EN 60068-2-58:2016-01

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. This standard describes the following tests: solderability of the terminals, resistance to soldering heat as well as de-wetting and resistance to dissolution of the metallization using the solder bath and reflow soldering processes. The normative Annex A describes criteria for visual inspection; the informative Annex B is an instruction for solderability tests. These should always be quantitative and objective. In the preparation of this standard, procedures that meet this requirement were considered; these are described in IEC 60068-2-69. The normative Annex C explains the application of the test methods to through-hole mounting elements for reflow soldering (THR). The informative Annex X contains the reference list to the previous edition of this specification. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7; - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for test; - de-wetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3. The committee responsible is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.