To our valued customers,
At last:
Beuth Verlag is now DIN Media.
You can find out more about our new name and the reasons behind it here.
To use our new website without any hiccups, please clear your browser cache.
Yours sincerely,
DIN Media
Standard [WITHDRAWN]
Product information on this site:
Quick delivery via download or delivery service
All transactions are encrypted
This part of the DIN EN 60749 standard series specifies a standard method which determines the preconditioning of non-hermetic surface mount devices (SMD) prior to reliability testing. This test method specifies the sequence of the preconditioning procedure for non-hermetic surface mount devices so that it is representative for standard industry processing with multiple reflow soldering. Surface mount devices should be subjected to a respective preconditioning sequence in accordance with this standard before they are handed in for specific in-house reliability testing (qualification testing and/or reliability monitor testing) in order to evaluate long-term reliability testing (which is affected by reflow soldering). Amendment A1 to IEC 60749-30:2005 or EN 60749-30:2005 updates the specifications contained regarding the references to IEC 60749-20:2008 (DIN EN 60749-20:2010). These modifications have been incorporated into DIN EN 60749-30 and marked. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
This document replaces DIN EN 60749-30:2005-06 .
This document has been replaced by: DIN EN IEC 60749-30:2023-02 .