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Standard [CURRENT]

DIN EN 60749-40:2012-02

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen (IEC 60749-40:2011); Deutsche Fassung EN 60749-40:2011
Publication date
2012-02
Original language
German
Pages
23

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Publication date
2012-02
Original language
German
Pages
23
DOI
https://dx.doi.org/10.31030/1855551

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Overview

This part of the DIN EN 60749 standard series is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of the circuit board causes product failure. The purpose is to standardize the test methodology to provide a reproducible assessment of the drop test performance of an SMD (surface mounted device) while duplicating the failure modes is normally observed during the product level test. This standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to measure both the mechanical shock duration and magnitude applied which is proportional to the stress on an SMD mounted on a standard board. The detailed specification shall state which of the two test methods is to be used. Although this test method can evaluate a structure where the mounting method and its conditions, the design of a printed wired board, solder material, the mounting capability of a semiconductor device, etcetera, are combined, it does not solely evaluate the mounting capability of a semiconductor device. The result of this test is strongly influenced by the differences between soldering conditions, the design of the land pattern of a printed wired board, solder material, etcetera. Therefore, in carrying out this test, it is necessary to recognize that this test cannot intrinsically ensure the reliability of the solder joint of the semiconductor devices. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

ICS
31.080.01
DOI
https://dx.doi.org/10.31030/1855551

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