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This document specifies an electromigration test on metal lines, vias and contact elements using the conventional constant current load for semiconductor devices. The background of electromigration testing as described in this procedure is based on the assumption that the entire electromigration failure time distribution stays intact when accelerated. Acceleration can be described by an activation energy and a current acceleration factor. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.