Standard
[CURRENT]
NF C96-022-8:2003-11-01;NF EN 60749-8:2003-11-01
NF EN 60749-8:2003-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 8: sealing
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 8: dichtheit
- Publication date
-
2003-11-01
- Original language
-
French
- Publication date
-
2003-11-01
- Original language
-
French
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