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Standard [CURRENT]

NF C96-022-8:2003-11-01;NF EN 60749-8:2003-11-01

NF EN 60749-8:2003-11-01

Semiconductor devices - Mechanical and climatic test methods - Part 8: sealing

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 8: dichtheit
Publication date
2003-11-01
Original language
French

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Publication date
2003-11-01
Original language
French

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