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Dear Customer,

This year, on the occasion of our 100th anniversary, we will be positioning ourselves for the future as part of the DIN Group with a new name. 

And so as of April 22, 2024

Beuth Verlag will become DIN Media. 

You can find out more about our new name and the reasons behind it here.

Yours sincerely,
Beuth Verlag

Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

OEVE/OENORM EN 60191-6-21:2011-05-01

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP) (IEC 60191-6-21:2010)
Publication date
2011-05-01
Original language
German
Pages
17

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Publication date
2011-05-01
Original language
German
Pages
17

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