OEVE/OENORM EN 60749-15:2011-08-01

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010) (german version)

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2010) (deutsche Fassung)
Publication date: 2011-08-01
Original language: German
Pages: 9

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Replacement amendments

This document has been replaced by: OVE EN IEC 60749-15:2022-06-01 .

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