OEVE/OENORM EN 60749-20:2010-05-01

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008) (german version)

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2008) (deutsche Fassung)
Publication date: 2010-05-01
Original language: German
Pages: 28

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Replacement amendments

This document has been replaced by: OVE EN IEC 60749-20:2023-08-01 .

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