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Standard 2012-11-01

OEVE/OENORM EN 62047-13:2012-11-01

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012) (german version)

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen (IEC 62047-13:2012) (deutsche Fassung)
Publication date
2012-11-01
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Original language
German

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Publication date
2012-11-01
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Original language
German

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