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Standard [CURRENT]

SN EN 62047-18:2013-09

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe
Publication date
2013-09
Original language
German
Pages
13

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Publication date
2013-09
Original language
German
Pages
13

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