Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007). (Endorsed by AENOR in December of 2007.)
Publication date
2007-12-01
Original language
English
Pages
38
Publication date
2007-12-01
Original language
English
Pages
38
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