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UNE-EN 61190-1-3:2007-12-01

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007). (Endorsed by AENOR in December of 2007.)

Publication date
2007-12-01
Original language
English
Pages
38
Publication date
2007-12-01
Original language
English
Pages
38

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Replacement amendments

This document has been replaced by: UNE-EN IEC 61190-1-3:2018-04-01 .

This document has been modified by: UNE-EN 61190-1-3/A1:2010-11-01

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