Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
German title
Halbleiterbauelemente - Zuverlässigkeit auf Waferniveau für Halbleiterbauelemente - Teil 1: Prüfverfahren zur Stressmigration von Kupfer (IEC 47/2191/CD:2014)
Date of issue
2014-07-18
Publication date
2014-08
Original language
German,
English
Pages
64
Date of issue
2014-07-18
Publication date
2014-08
Original language
German,
English
Pages
64
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