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Draft standard

DIN EN IEC 60749-20-1:2018-11 - Draft

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind (IEC 47/2488/CDV:2018); Deutsche und Englische Fassung prEN IEC 60749-20-1:2018
Date of issue
2018-10-26
Publication date
2018-11
Original language
German, English
Pages
79

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Date of issue
2018-10-26
Publication date
2018-11
Original language
German, English
Pages
79
DOI
https://dx.doi.org/10.31030/3000664

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3000664

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