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Draft standard [WITHDRAWN]

DIN EN IEC 61189-5-301:2020-12 - Draft

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles (IEC 91/1620/CD:2019); Text in German and English

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-301: Prüfverfahren für Leiterplattenbaugruppen - Lötpaste mit feinen Lötpartikeln (IEC 91/1620/CD:2019); Text Deutsch und Englisch
Date of issue
2020-11-20
Publication date
2020-12
Original language
German, English
Pages
64

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Date of issue
2020-11-20
Publication date
2020-12
Original language
German, English
Pages
64
DOI
https://dx.doi.org/10.31030/3214906

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ICS
31.180
DOI
https://dx.doi.org/10.31030/3214906
Replacement amendments

This document has been replaced by: DIN EN IEC 61189-5-301:2022-08 .

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