MID technology enables the integration of mechanical, electrical, electronic and thermal functions on a spatial circuit carrier. This enables assemblies with a high functional density and a considerable degree of miniaturization. At present, however, there are no generally applicable standards for the manufacture of MIDs that process managers and customers can use as a guideline. In a first step, this standard defines a consolidated point of view on the procedures for the production of reliable MID components. It is aimed at users and producers of mechatronically integrated assemblies.