We use cookies to make our websites more user-friendly and to continuously improve them. If you continue to use the website, you consent to the use of cookies. You can find more information in our privacy statement and our cookie guidelines.

To our valued customers,

At last: 

Beuth Verlag is now DIN Media. 

You can find out more about our new name and the reasons behind it here.

To use our new website without any hiccups, please clear your browser cache. 

Yours sincerely,

DIN Media

Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT]

DIN EN 60191-6-13:2017-06

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 60191-6-13:2016); Deutsche Fassung EN 60191-6-13:2016
Publication date
2017-06
Original language
German
Pages
20

Please select

from 99.10 EUR VAT included

from 92.62 EUR VAT excluded

Purchasing options

PDF download

  • 99.10 EUR

Shipment (3-5 working days)

  • 119.80 EUR

Standards Ticker 1
1

Learn more about the standards ticker

Publication date
2017-06
Original language
German
Pages
20
DOI
https://dx.doi.org/10.31030/2646994

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

ICS
31.240
DOI
https://dx.doi.org/10.31030/2646994
Replacement amendments

This document replaces DIN EN 60191-6-13:2008-04 .

Cooperation at DIN

Relationship to other standards
This document references:
Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...