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Standard [CURRENT]

DIN EN 60749-32:2011-01

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 32: Entflammbarkeit von Bauelementen in Kunststoffgehäusen (Fremdentzündung) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); Deutsche Fassung EN 60749-32:2003 + Cor. :2003 + A1:2010
Publication date
2011-01
Original language
German
Pages
8

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Publication date
2011-01
Original language
German
Pages
8
DOI
https://dx.doi.org/10.31030/1733325

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Overview

This test method is applicable to all semiconductor devices (discrete semiconductor devices and integrated circuits) and is intended to determine flammability of semiconductor devices due to external heating. By incorporating the amendment, the dated reference for the test standard to be applied has been updated to read IEC 60695-11-5:2005. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

ICS
13.220.40, 31.080.01
DOI
https://dx.doi.org/10.31030/1733325
Replacement amendments

This document replaces DIN EN 60749-32:2003-12 .

Cooperation at DIN

Relationship to other standards
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