To our valued customers,

At last: 

Beuth Verlag is now DIN Media. 

You can find out more about our new name and the reasons behind it here.

To use our new website without any hiccups, please clear your browser cache. 

Yours sincerely,

DIN Media

Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT]

DIN EN 62047-12:2012-06

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen (IEC 62047-12:2011); Deutsche Fassung EN 62047-12:2011
Publication date
2012-06
Original language
German
Pages
31

Please select

from 117.70 EUR VAT included

from 110.00 EUR VAT excluded

Purchasing options

PDF download
  • 117.70 EUR

Shipment (3-5 working days)
  • 142.60 EUR

Standards Ticker 1
1

Learn more about the standards ticker

Publication date
2012-06
Original language
German
Pages
31
DOI
https://dx.doi.org/10.31030/1881344

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Overview

The main structural materials for MEMS, micromachine, etcetera, have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra-high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration. This part of the DIN EN 62047 standard series specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 µm to 1 000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Content
ICS
31.080.01, 31.220.01
DOI
https://dx.doi.org/10.31030/1881344

Cooperation at DIN

Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...