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Standard [CURRENT]

DIN EN 62610-4:2014-04

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013

German title
Mechanische Bauweisen für elektronische Einrichtungen - Wärmemanagement für Schränke nach den Reihen IEC 60297 und IEC 60917 - Teil 4: Kühlleistungsprüfungen für Wasser-Wärmetauscher in Elektronikschränken (IEC 62610-4:2013); Deutsche Fassung EN 62610-4:2013
Publication date
2014-04
Original language
German
Pages
20

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Publication date
2014-04
Original language
German
Pages
20
DOI
https://dx.doi.org/10.31030/2085591

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Overview

Electronic cabinets of the IEC 60297 and IEC 60917 standard series are used for the housing of electronic devices in many different fields of application. A wide field of application is represented by installations of communication networks with electronic devices in information technology (IT) environments. The classic way is to install rows of cabinets into defined foot print patterns and interconnect them via cables managed from overhead cable trays or raised floor cable management. So far, cooling has been facilitated by equipping the entire IT room with air conditioning in order to provide for air flow and air temperatures required for the safe operation of the electronic devices. With the growing heat load in data centers, this form of cooling has become more and more inefficient. Thermal problems with respect to high-performance electronic devices have become more difficult to solve. The environmental aspect is gaining crucial importance forcing us to cut down on wasting resources and to reduce CO2 emissions. This standard specifies the test setup and test parameters for water supplied heat exchangers within single electronic cabinet configurations. The purpose of this standard is to provide comparable data for the cooling performance of cabinets according to defined test setups and cooling parameters. The responsible committee is DKE/K 662 "Bauweisen" ("Structures") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

ICS
31.240
DOI
https://dx.doi.org/10.31030/2085591

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