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IEC 62047-2:2006-08

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

German title
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 2: Prüfverfahren zur Zugbeanspruchung bei Dünnschicht-Werkstoffen
Publication date
2006-08
Original language
English, French
Pages
25
Publication date
2006-08
Original language
English, French
Pages
25

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