We use cookies to make our websites more user-friendly and to continuously improve them. If you continue to use the website, you consent to the use of cookies. You can find more information in our privacy statement and our cookie guidelines.

To our valued customers,

At last: 

Beuth Verlag is now DIN Media. 

You can find out more about our new name and the reasons behind it here.

To use our new website without any hiccups, please clear your browser cache. 

Yours sincerely,

DIN Media

Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT]

NF C96-013-6-17:2012-10-01

NF EN 60191-6-17:2012-10-01

Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-17 : Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für gestapelte Gehäuse - Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (P-PFBGA/P-PFLGA)
Publication date
2012-10-01
Original language
French
Pages
31

Please select

from 105.40 EUR VAT included

from 98.50 EUR VAT excluded

Purchasing options

PDF download

  • 105.40 EUR

Shipment (3-5 working days)

  • 118.20 EUR

Standards Ticker 1
1

Learn more about the standards ticker

Publication date
2012-10-01
Original language
French
Pages
31

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...