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Standards Worldwide
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Standard [CURRENT]

NF C96-022-20-1:2009-07-01

NF EN 60749-20-1:2009-07-01

Semiconductor devices - Mechanical and climatic test methods - Part 20-1 : handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1 : Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind
Publication date
2009-07-01
Original language
French
Pages
37

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Publication date
2009-07-01
Original language
French
Pages
37

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