Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017) (german version)
German title
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage (IEC 61191-3:2017) (deutsche Fassung)
Publication date
2018-06-01
Original language
German
Pages
22
Publication date
2018-06-01
Original language
German
Pages
22
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