Determining the machine capability of dispensing systems
German title
Bestimmung der Maschinenfähigkeit von Dispenssystemen
Publication date
2002-03
Original language
German,
English
Pages
16
Publication date
2002-03
Original language
German,
English
Pages
16
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Short description
The guideline assesses the machine capability of despensing systems. With the aid of the test board dispensing accuracy and the performance of dispensing systems can be examined. Either solder paste, SMD adhesive or conductive epoxy can be used as an application medium. The guideline will serve as a basis not only for an objective comparison between dispensing systems but also for continuous testing of the machine during procuction.