Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
German title
Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen
Publication date
2011-11-30
Original language
English
Pages
34
Publication date
2011-11-30
Original language
English
Pages
34
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