The DIN EN 60191-6 standard series is based on the corresponding IEC 60191-6 series of International Standards. It defines rules for outline drawings of surface mounted semiconductor device packages of varying package and terminal designs which are used during computer supported design and manufacturing processes. The trend toward downsizing and higher density of portable electronic devices has driven LSI packages into smaller and higher density configurations. The market demand of higher density has led to the development of the package stacking technology that enabled miniaturization and higher functionality. The objective of this design guide is to standardize outlines and to get interchangeability of individual stackable packages. This part of DIN EN 60191 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of fine-pitch ball grid array (FBGA) and fine pitch land grid array (FLGA). The responsible Committee is Subcommittee UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.