This part of DIN EN 60191 contains general rules for the preparation of outline drawings of surface mounted semiconductor devices. It supplements DIN EN 60191-1 and DIN EN 60191-3 with specifications for any surface mounted discrete semiconductor device with lead counts of greater or equal to 8, as well as integrated circuits classified as form E in clause 3 of DIN EN 60191-4. Thus the standard defines dimensions, rules and symbols, which shall be specified when designing surface mounted semiconductor devices. It also helps the user of these packages to understand standardized drawings and dimension tables of the package manufacturer. With regard to DIN EN 60191-6:2005-04 the following changes have been made: a) the scope has been modified to cover all surface mounting discrete semiconductor devices with lead counts of greater or equal to 8; b) technical revision of the ball-grid-array packages (BGA), especially their geometrical drawing formats (as a result of the revision the present two types of BGA have been transferred into a uniform format) and c) editorial revision. The responsible Subcommittee is UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.