OEVE/OENORM EN 60749-30:2012-02-01

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011) (german version)

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen (IEC 60749-30:2005 + A1:2011) (deutsche Fassung)
Publication date: 2012-02-01
Original language: German
Pages: 14

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Replacement amendments

This document has been replaced by: OVE EN IEC 60749-30:2023-03-01 .

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